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  october 2011 doc id 022015 rev 1 1/11 11 stps20sm60c power schottky rectifier features high current capability avalanche rated low forward voltage drop high frequency operation description the stps20sm60c is a dual diode schottky rectifier, suited for high frequency switch mode power supply. packaged in to-220ab, to-220fpab, i 2 pak and d 2 pak, this device is intended to be used in notebook, game station and desktop adapters, providing in these aplications a good efficiency at both low and high load. figure 1. electrical characteristics (a) table 1. device summary symbol value i f(av) 2 x 10 a v rrm 60 v v f (typ) 0.420 v t j (max) 150 c a. v arm and i arm must respect the reverse safe operating area defined in figure 14 . v ar and i ar are pulse measurements (t p < 1 s). v r , i r , v rrm and v f , are static characteristics a1 k a2 a1 a2 k a1 a2 k k a1 a2 k k to-220ab stps20sm60ct to-220fpab stps20sm60cfp i 2 pak STPS20SM60CR d 2 pak stps20sm60cg-tr a1 a2 k i f 2 x i o i o i r i ar v f(i o ) v to v f(2xi o ) v f v i i v v r v rrm "reverse" "forward" v ar x x www.st.com
characteristics stps20sm60c 2/11 doc id 022015 rev 1 1 characteristics when the two diodes 1 and 2 are used simultaneously: t j (diode 1) = p(diode 1) x r th(j-c) (per diode) + p(diode 2) x r th(c) table 2. absolute ratings (limiting values, per diode, at t amb = 25 c unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) forward rms current 30 a i f(av) average forward current, = 0.5 to-220ab, i 2 pak, d 2 pa k t c = 135 c t c = 130 c per diode per device 10 20 a to-220fpab t c = 110 c t c = 90 c per diode per device 10 20 i fsm surge non repetitive forward current t p = 10 ms sine-wave 220 a p arm (1) 1. for temperature or pulse time duration deratings, please refer to figure 4 and 5 . more details regarding the avalanche energy measurements and diode validation in the avalanc he are provided in the application notes an1768 and an2025. repetitive peak avalanche power t j = 25 c, t p = 1 s 8700 w v arm (2) 2. see figure 14 maximum repetitive peak avalanche voltage t p < 1 s, t j < 150 c, i ar < 32.6 a 80 v v asm (2) maximum single pulse peak avalanche voltage t p < 1 s, t j < 150 c, i ar < 32.6 a 80 v t stg storage temperature range -65 to +175 c t j maximum operating junction temperature (3) 3. condition to avoid thermal runaway for a diode on its own heatsink 150 c table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case to-220ab i 2 pa k , d 2 pa k per diode 2.00 c/w total 1.13 to-220fpab per diode 4.90 total 4.05 r th(c) coupling to-220ab, i 2 pa k , d 2 pa k 0 . 2 5 c/w to-220fpab 3.20 dptot dtj < 1 rth(j-a)
stps20sm60c characteristics doc id 022015 rev 1 3/11 to evaluate the conduction losses use the following equation: p = 0.455 x i f(av) + 0.0145 x i f 2 (rms) table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm -1040a t j = 125 c - 5 25 ma v f (2) forward voltage drop t j = 25 c i f = 5 a - 0.505 0.545 v t j = 125 c - 0.420 0.475 t j = 25 c i f = 10 a - 0.580 0.645 t j = 125 c - 0.525 0.600 1. pulse test: t p = 5 ms, < 2 % 2. pulse test: t p = 380 s, < 2 % figure 2. average forward power dissipation versus average forward current (per diode) figure 3. average forward current versus ambient temperature ( = 0.5, per diode) p (w) f(av) 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 10 11 12 13 = 0.05 = 0.1 = 0.2 = 0.5 = 1 t = t / t p t p i (a) f(av) i (a) f(av) 0 2 4 6 8 10 12 0 25 50 75 100 125 150 r th(j-a) = r th(j-c) t (c) amb to-220ab/i pak/d pak 22 to-220fpab figure 4. normalized avalanche power derating versus pulse duration figure 5. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 p(t p ) p (1s) arm arm t (s) p 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 p(t) p (25 c) arm j arm t (c) j
characteristics stps20sm60c 4/11 doc id 022015 rev 1 figure 6. non repetitive surge peak forward current versus overload duration (maximum values, per diode) figure 7. non repetitive surge peak forward current versus overload duration (maximum values, per diode) i (a) m 0 20 40 60 80 100 120 140 160 1.e-03 1.e-02 1.e-01 1.e+00 i m t = 0.5 t = 25 c c t = 75 c c t = 125 c c t(s) to-220ab/i pak/d pak 22 0 10 20 30 40 50 60 70 80 90 100 1.e-03 1.e-02 1.e-01 1.e+00 i (a) m i m t = 0.5 t = 25 c c t = 75 c c t = 125 c c to-220fpab figure 8. relative thermal impedance junction to case versus pulse duration figure 9. relative thermal impedance junction to case versus pulse duration z/r th(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse t (s) p to-220ab/i pak/d pak 22 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 z/r th(j-c) th(j-c) single pulse t (s) p to-220fpab figure 10. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 11. junction capacitance versus reverse voltage applied (typical values, per diode) i (ma) r 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 102030405060 v (v) r t = 25 c j t = 50 c j t = 75 c j t = 100 c j t = 125 c j t = 150 c j c(pf) 100 1000 1 10 100 v (v) r f = 1 mhz v = 30 mv t = 25 c osc rms j
stps20sm60c characteristics doc id 022015 rev 1 5/11 figure 14. reverse safe operating area (t p < 1 s and t j < 150 c) figure 12. forward voltage drop versus forward current (per diode) figure 13. thermal resistance junction to ambient versus copper surface under tab i (a) fm 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 v (v) fm t = 125 c (maximum values) j t = 125 c (typical values) j t = 25 c (maximum values) j 0 10 20 30 40 50 60 70 80 05 1 0 1 5 2 0 2 53035 4 0 dpak 2 r (c/w) th(j-a) s (cm2) cu epoxy printed circuit board fr4 copper thickness = 35 m 20.0 22.0 24.0 26.0 28.0 30.0 32.0 34.0 80 85 90 95 100 105 110 115 120 i (a) arm v (v) arm i (v ) 150 c, 1s arm arm
package information stps20sm60c 6/11 doc id 022015 rev 1 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.4 to 0.6 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 5. to-220ab dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. dia. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
stps20sm60c package information doc id 022015 rev 1 7/11 table 6. to-220fpab dimensions ref. dimensions millimeters inches min. max. min. max. a 4.4 4.9 0.173 0.192 b 2.5 2.9 0.098 0.114 d 2.45 2.75 0.096 0.108 e 0.4 0.7 0.016 0.028 f 0.6 1 0.024 0.039 f1 1.15 1.7 0.045 0.067 f2 1.15 1.7 0.045 0.067 g 4.95 5.2 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.7 0.394 0.421 l2 16 typ. 0.630 typ. l3 28.6 30.6 1.126 1.205 l4 9.8 10.7 0.386 0.421 l6 15.8 16.4 0.622 0.646 l7 9 9.9 0.354 0.390 dia. 2.9 3.5 0.114 0.138 h l3 l2 l6 l7 g g1 f f1 f2 l4 d e a b dia.
package information stps20sm60c 8/11 doc id 022015 rev 1 figure 15. d 2 pak footprint (dimensions in mm) table 7. d 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2mm a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
stps20sm60c package information doc id 022015 rev 1 9/11 table 8. i 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 e 10 10.40 0.394 0.409 l 13 14 0.512 0.551 l1 3.50 3.93 0.138 0.155 l2 1.27 1.40 0.050 0.055 e l2 l1 b1 d a1 c c2 a b e e1 l
ordering information stps20sm60c 10/11 doc id 022015 rev 1 3 ordering information 4 revision history table 9. ordering information order code marking package weight base qty delivery mode stps20sm60ct stps20sm60ct to-220ab 2.20 g 50 tube stps20sm60cfp ps20sm60cfp to-220fpab 2.0 g 50 tube STPS20SM60CR STPS20SM60CR i 2 pak 1.49 g 50 tube stps20sm60cg-tr stps20sm60cg d 2 pak 1.48 g 1000 tape and reel table 10. revision history date revision changes 14-oct-2011 1 initial release.
stps20sm60c doc id 022015 rev 1 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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